If you’ve been keeping tabs on smartphone news over the past few months, you probably already know that Qualcomm’s most powerful chipset yet, the Snapdragon 820, will be available in handsets in early 2016.
A lot has been said about the product, and speculation as to which phone will carry it first has picked up in the weeks leading up to CES 2016.
Well, the largest consumer electronics show in the world is in full swing now, and it has confirmed that the Samsung Galaxy S7 won’t be the product that debuts Qualcomm’s latest top-end effort, contrary to earlier rumors. That distinction belongs to — cue a drumroll, please — Chinese brand LeTV’s Le Max Pro. Yes, LeTV is a phone brand and the Le Max Pro is the actual name of the company’s upcoming flagship product, though you’d be forgiven for not being familiar with either one of these names.
The Snapdragon 820 chip inside the Le Max Pro is said to offer twice the performance and efficiency of the Snapdragon 810 and features four CPU cores clocked at 2.2GHz.
The Snapdragon 820 chip inside the Le Max Pro is said to offer twice the performance and efficiency of the Snapdragon 810 and features four CPU cores clocked at 2.2GHz, alongside an Adreno 530 GPU with 4GB of RAM and either 32, 64, or 128GB of onboard storage.
The phone makes use of LeTV’s own custom UI based on Android 6.0 Marshmallow and shares a number of design cues with the similarly big-screened Huawei Mate 8. A few other notable specifications include a 6.3-inch, 1,440 x 2,560 display, a 21-megapixel rear shooter, a 3,400mAh battery, and a fingerprint sensor that features Qualcomm’s Snapdragon Sense ID fingerprint-reader technology.
There’s no word on pricing or availability yet, but the LeTV Le Max Pro has been confirmed for a U.S. release this year.
LeTV Le Max Pro preview video courtesy of CNET
Image via Android Central
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