Taiwanese chip manufacturer MediaTek has silently unveiled a new midrange 5G chipset, the Dimensity 7050, and we probably won’t wait too long to see the first smartphone that will use it.
The upcoming realme 11 Pro Plus 5G was recently spotted on the Geekbench website with a MediaTek Dimensity 7050 chip and 12GB of RAM. The phone will run Android 13 out of the box and is believed to be the first device to ship with the said processor. It scored 838 and 2,303 points in Geekbench’s single- and multi-core tests, respectively.
As for the chipset, the MediaTek Dimensity 7050 has been built using TSMC’s 6nm process technology and uses an eight-core CPU design with two Cortex-A78 performance cores clocked up to 2.6GHz and six Cortex-A55 power-efficiency cores. It has a four-core Mali-G68 GPU for graphics as well. Here’s where you can see the new mobile platform’s full specs.
Ahead of the phone lineup’s May 10 launch, a short teaser video featuring the realme 11 Pro series has been posted online, revealing that it will come with a faux-leather back and stitching along the middle of the rear panel. The lineup has been co-designed by the realme Design Studio and former Gucci Prints designer Matteo Menotto. It will be available in three color options — Astral Black, Green Oasis, and Sunrise Beige.
The realme 11 Pro Plus 5G was previously confirmed to sport a 10-bit 6.7-inch AMOLED curved screen featuring a 120Hz refresh rate. It will also pack a 200-megapixel main camera in a circular camera module alongside a pair of additional lenses. It has been tipped with a 16-megapixel selfie camera as well, in addition to a 5,000mAh battery that supports 80-watt wired fast charging.
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