MediaTek, the industry’s leading mobile chip maker with a reported 30% market share in Q2 2023, has announced the MediaTek Dimensity 9300. The Taiwanese manufacturer’s latest flagship chipset will go head-to-head with the recently launched Qualcomm Snapdragon 8 Gen 3.
Unlike Qualcomm’s top-end processor, though, the new Dimensity 9300 is built on TSMC’s third-generation 4nm process node and uses an “All Big Core” design, headlined by a high-performance Cortex-X4 core clocked at 3.25GHz. The prime core is joined by three Cortex-X4 cores and four Cortex-A720 cores operating at 2.85GHz and 2.0GHz, respectively.
ARM’s new Immortalis-G720 GPU takes care of graphics and debuts with hardware-based ray tracing, and MediaTek says the Dimensity 9300 offers “an almost 46% boost in GPU performance while at the same level of power consumption” as last year’s Dimensity 9200 SoC. Similarly, the GPU is supposed to consume 40% less power at the same level of performance as the previous-gen chip.
The #MediaTekDimensity9300 is here! Our supercharged #5G SoC features a one-of-a-kind #AllBigCore design to maximize smartphone performance & efficiency– a unique configuration resulting in unmatched gaming, video, and on-device #generativeAI processing. https://t.co/dxdXYEebdC pic.twitter.com/Ko0Dt0Rrp1— MediaTek (@MediaTek) November 6, 2023
Introduction video. Will the MediaTek Dimensity 9300 debut on the vivo X100 series?
Its integrated APU 790 AI processor, on the other hand, promises significantly improved performance when running AI tasks and supports on-device generative AI with Stable Diffusion optimization. Additionally, the Dimensity 9300 brings support for LPDDR5T memory with speeds of up to 9,600Mbps — currently the highest speed available on the market.
According to MediaTek, the first smartphones featuring its latest chipset will hit stores by the end of 2023. Barring any surprises, the Dimensity 9300 is expected to make its debut in the upcoming vivo X100 series, which launches tomorrow in China.
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