Huawei recently published a video revealing that its next-generation flagship chipset, the Kirin 990, will be introduced at IFA 2019 in Berlin on September 6. The date coincides with the company’s keynote at the annual consumer-electronics trade fair.
Kirin 990 launch teaser
Like other Kirin chips, the Kirin 990 will be built by Huawei’s HiSilicon semiconductor division and manufactured using TSMC’s 7nm EUV process. And although the upcoming chip will be utilizing a 7nm fabrication process like last year’s Kirin 980, the Kirin 990 is expected to offer 20% more transistor density, which should translate to better performance and power efficiency compared to its predecessors.
Importantly, the video hints at the possibility of Huawei integrating a 5G modem into the Kirin 990’s design. The Kirin 980 also allows for 5G connectivity, but only by pairing it with a separate 5G modem on the logic board.
The Kirin 990 has likewise been tipped to bring 4K video at 60 frames per second to Huawei devices for the first time. We can also expect a better AI chip based on Huawei’s Da Vinci architecture, as well as faster CPU and GPU components. It’s likely that the new chip will be based on ARM’s latest Cortex-A77 spec, while the graphics will probably be handled by the new Mali-G77.
The Kirin 990 has been confirmed for the Huawei Mate X foldable phone, and it’s likely to be the brains inside the Huawei Mate 30 series as well. We’ll keep you informed as further updates roll in.
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