MediaTek has finally taken the wraps off its new Dimensity 8100, Dimensity 8000, and Dimensity 1300 5G chipsets. The latter brings marginal improvements over the Dimensity 1200 chip, which powers premium devices like the Vivo X70, Xiaomi 11T, and Realme GT Neo.
According to MediaTek, smartphones built around its latest 5G chipsets will launch globally sometime in March. The Realme GT Neo 3 has been confirmed to arrive with the Dimensity 8100 processor, making it one of the first handsets available on the said mobile platform.
More impressively, the phone is expected to debut Realme’s 150-watt UltraDart Charge technology that can give its battery 50% charge in just five minutes. Reports claim the GT Neo 3 that supports 150W charging will get a flagship Qualcomm chip, most likely the Qualcomm Snapdragon 888, suggesting the handset could have two variants. We’ll know soon enough, as Realme vice president and Realme International Business Group president Madhav Sheth divulged that the unit will arrive “in the first half of H2.”
The Realme GT Neo 3 will be launched as one of the first MediaTek Dimensity 8100-powered smartphones
Both the MediaTek Dimensity 8100 and 8000 chipsets are made using a 5nm process and feature four Cortex-A78 performance cores as well as four Cortex-A55 efficiency cores. The GPU is a Mali-G610 MC6.
It seems the biggest difference between the two is the GPU performance; the Dimensity 8100 should have a 20% higher GPU frequency than the Dimensity 8000. That translates to higher benchmarks — and likely higher frame rates when playing games. The Dimensity 8100 also supports WQHD+ displays running at 120Hz, whereas the Dimensity 8000 does not. But for the most part, the two SoCs are nearly identical.
It’s worth mentioning, too, that the 8100 has been leaked extensively over the past few weeks, with the chipset managing to outperform the Qualcomm Snapdragon 888 in certain benchmarks.
MediaTek’s press release
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